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産業分野における効率的な検査、最適化されたワークフロー、人間工学に基づく快適性に焦点を当てた詳細な記事やウェビナーをぜひご覧ください。品質管理、材料解析における顕微鏡検査など、幅広いトピックを取り上げています。製造工程の精度と効率を向上させる技術や、最先端技術の活用について、貴重な知見を得ることができます。

Example of calibrating a microscope at a higher magnification value using a stage micrometer.

Microscope Calibration for Measurements: Why and How You Should Do It

Microscope calibration ensures accurate and consistent measurements for inspection, quality control (QC), failure analysis, and research and development (R&D). Calibration steps are described in this…

Documentation of an automotive clutch friction surface with a digital microscope

Automotive Part Verification and Development according to Specifications

Automotive part verification during the development and production of parts and components by suppliers or manufacturers is important for ensuring that specifications are met. Specifications are…

Area of a printed circuit board (PCB) which was imaged with extended depth of field (EDOF) using digital microscopy.

顕微鏡を知る：被写界深度

顕微鏡において被写界深度は、凹凸の変化が⼤きい構造を持つ試料をピントがあったシャープに観察・撮像するために重要なパラメータです。被写界深度は、開⼝数、解像度、倍率の相関関係によって決定され、解像度とパラメータは反⽐例の関係にあります。被写界深度と解像度のバランスが最適になるように調整することができる顕微鏡もあります。

Image of magnetic steel taken with a 100x objective using Kerr microscopy. The magnetic domains in the grains appear in the image with lighter and darker patterns. A few domains are marked with red arrows. Courtesy of Florian Lang-Melzian, Robert Bosch GmbH, Germany.

Rapidly Visualizing Magnetic Domains in Steel with Kerr Microscopy

The rotation of polarized light after interaction with magnetic domains in a material, known as the Kerr effect, enables the investigation of magnetized samples with Kerr microscopy. It allows rapid…

Region of a patterned wafer inspected using optical microscopy and automated and reproducible DIC (differential interference contrast). With DIC users are able to visualize small height differences on the wafer surface more easily.

6-Inch Wafer Inspection Microscope for Reliably Observing Small Height Differences

A 6-inch wafer inspection microscope with automated and reproducible DIC (differential interference contrast) imaging, no matter the skill level of users, is described in this article. Manufacturing…

Image of burrs (red arrows) at the edge of a battery electrode acquired with a DVM6 digital microscope.

Burr Detection During Battery Manufacturing

See how optical microscopy can be used for burr detection on battery electrodes and determination of damage potential to achieve rapid and reliable quality control during battery manufacturing.

Particles observed on the surface of a particle trap which could be used for technical cleanliness during battery production.

Battery Particle Detection During the Production Process

How battery particle detection and analysis is enhanced with optical microscopy and laser spectroscopy for rapid, reliable, and cost-effective QC during battery production is explained in this…

Particulate contamination in between moving metal plates.

Key Factors for Efficient Cleanliness Analysis

An overview of the key factors necessary for technical cleanliness and efficient cleanliness analysis concerning automotive and electronics manufacturing and production is provided in this article.

Preparation of an IC-chip cross section: grinding and polishing of the chip cross section.

Cross-section Analysis for Electronics Manufacturing

This article describes cross-section analysis for electronics concerning quality control and failure analysis of printed circuit boards (PCBs) and assemblies (PCBAs), integrated circuits (ICs), etc.