Method: Cross sectioning by ion beam slope cutting
Fig. 1: a) At first, a mechanical pre-preparation is performed using the Leica TXP (cross sectioning) to approach the area of interest in a very short time. b) Then, with the Leica TIC 3X (broad ion milling) a perfect cross-section surface is achieved, which is ready for EBSD analysis.
Results on a semiconductor
Results on a aluminum/diamond/graphite composite
Fig. 3c: EBSD patterns of the different phases.
EBSD phase map
While the Focused Ion Beam technique is often used for site specific sample preparation, it usually prevents from a successful EBSD analysis by introducing sub-surface deformation and curtaining especially on multiphase material. In this example we have demonstrated that broad ion beam milling allows to simultaneously polish both hard and soft material.
We thank Andi Kaeppel and Roald Tagle for taking the M4 picture, Figure 2b.
Gang Ji, et al.: Materials Characterization 89: 132–37 (2014).