Method: Cross sectioning by ion beam slope cutting
Fig. 1: a) At first, a mechanical pre-preparation is performed using the Leica TXP (cross sectioning) to approach the area of interest in a very short time. b) Then, with the Leica TIC 3X (broad ion milling) a perfect cross-section surface is achieved, which is ready for EBSD analysis.
Results on a semiconductor
Results on a aluminum/diamond/graphite composite
Fig. 3c: EBSD patterns of the different phases.
Fig. 3d: Overview of the prepared surface (in total 3 mm were polished).
Pattern quality map
Fig. 3e: Pattern quality map of the EBSD/EDS analysis.
EBSD phase map
Fig. 3f: EBSD Phase map showing the high indexing rate, even on the graphite flakes. Graphite is displayed in blue, diamond in red and aluminum in green.
IPF X map
Fig. 3g: Corresponding EBSD orientation map along the X axis.
While the Focused Ion Beam technique is often used for site specific sample preparation, it usually prevents from a successful EBSD analysis by introducing sub-surface deformation and curtaining especially on multiphase material. In this example we have demonstrated that broad ion beam milling allows to simultaneously polish both hard and soft material.
The combined use of the Leica EM TXP and the Leica EM TIC 3X allows to perfectly prepare large areas of very challenging samples within a short time.
We thank Andi Kaeppel and Roald Tagle for taking the M4 picture, Figure 2b.
Gang Ji, et al.: Materials Characterization 89: 132–37 (2014).
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