インダストリー

インダストリー

インダストリー

産業分野における効率的な検査、最適化されたワークフロー、人間工学に基づく快適性に焦点を当てた詳細な記事やウェビナーをぜひご覧ください。品質管理、材料解析における顕微鏡検査など、幅広いトピックを取り上げています。製造工程の精度と効率を向上させる技術や、最先端技術の活用について、貴重な知見を得ることができます。
Documentation of an automotive clutch friction surface with a digital microscope

Automotive Part Verification and Development according to Specifications

Automotive part verification during the development and production of parts and components by suppliers or manufacturers is important for ensuring that specifications are met. Specifications are…
Optical microscope image, which is a composition of both brightfield and fluorescence illumination, showing organic contamination on a wafer surface. The inset images in the upper left corner show the brightfield image (above) and fluorescence image (below with dark background).

Visualizing Photoresist Residue and Organic Contamination on Wafers

As the scale of integrated circuits (ICs) on semiconductors passes below 10 nm, efficient detection of organic contamination, like photoresist residue, and defects during wafer inspection is becoming…
Image of burrs (red arrows) at the edge of a battery electrode acquired with a DVM6 digital microscope.

Burr Detection During Battery Manufacturing

See how optical microscopy can be used for burr detection on battery electrodes and determination of damage potential to achieve rapid and reliable quality control during battery manufacturing.
Particles observed on the surface of a particle trap which could be used for technical cleanliness during battery production.

Battery Particle Detection During the Production Process

How battery particle detection and analysis is enhanced with optical microscopy and laser spectroscopy for rapid, reliable, and cost-effective QC during battery production is explained in this…
Particulate contamination in between moving metal plates.

Key Factors for Efficient Cleanliness Analysis

An overview of the key factors necessary for technical cleanliness and efficient cleanliness analysis concerning automotive and electronics manufacturing and production is provided in this article.
Images of the same area of a processed wafer taken with standard (left) and oblique (right) brightfield illumination using a Leica compound microscope. The defect on the wafer surface is clearly more visible with oblique illumination.

Rapid Semiconductor Inspection with Microscope Contrast Methods

Semiconductor inspection during the production of patterned wafers and ICs (integrated circuits) is important for identifying and minimizing defects. To increase the efficiency of quality control in…
Preparation of an IC-chip cross section: grinding and polishing of the chip cross section.

Cross-section Analysis for Electronics Manufacturing

This article describes cross-section analysis for electronics concerning quality control and failure analysis of printed circuit boards (PCBs) and assemblies (PCBAs), integrated circuits (ICs), etc.
Image of a Siemens star, where the diameter of the 1st black line circle is 10 mm and the 2nd is 20 mm, taken via an eyepiece of a M205 A stereo microscope. The rectangles represent the field of view (FOV) of a Leica digital camera when installed with various C-mounts (red 0.32x, blue 0.5x, green 0.63x).

Understanding Clearly the Magnification of Microscopy

To help users better understand the magnification of microscopy and how to determine the useful range of magnification values for digital microscopes, this article provides helpful guidelines.
Material sample with a large height, size, and weight being observed with an inverted microscope.

Five Inverted-Microscope Advantages for Industrial Applications

With inverted microscopes, you look at samples from below since their optics are placed under the sample, with upright microscopes you look at samples from above. Traditionally, inverted microscopes…
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