EM TIC 3X Configurable Ion Beam Milling System

Ion beam milling is a sample preparation technique that uses high-energy argon ions to remove material from a sample surface. The EM TIC 3X uses a triple broad ion beam system to create high-quality surfaces for SEM, EBSD, and other microscopy techniques.

The EM TIC 3X delivers artifact-free surfaces essential for high-resolution SEM imaging. Its triple ion beam design ensures uniform milling and minimal sample damage, making it ideal for material sciences and failure analysis.

The system is suitable for a wide range of materials, including metals, ceramics, polymers, composites, and biological samples. It handles both hard and soft materials with high precision.

The triple beam configuration allows for simultaneous milling from three angles, reducing redeposition, striations, and enhancing surface flatness. This results in superior imaging quality and more accurate analytical results.

Yes, the system supports cryo and vacuum transfer stages, enabling preparation of temperature- or air-sensitive samples without air-exposure or temperature-related structural changes.

It can process samples up to 25 x 20 x 5 mm (thick), making it versatile for various research and industrial applications.

Yes, it integrates seamlessly with the EM TXP for mechanical pre-preparation, allowing a complete workflow from cutting and polishing to final ion milling. It is also compatible with the EM VCT500 transfer system and EM ACE600 coater, providing a full, streamlined workflow for surface preparation.

Ion beam milling provides cleaner, more uniform surfaces with fewer artifacts. It is especially beneficial for delicate or heterogeneous materials where mechanical methods may cause damage.

Ion milling is a physical etching process used to remove material from a sample surface using a focused beam of ions, typically argon. It is primarily used in electron microscopy to prepare ultra-smooth, artifact-free surfaces or cross-sections for high-resolution imaging and analysis.

Advantages:

• Produces clean, damage-free surfaces
• Suitable for hard, soft, and heterogeneous materials
• Ideal for smoothing and polishing cross-sections created by mechanical methods (e.g., with the EM TXP)
• Non-contact method, reducing mechanical stress

Limitations:

• Slower than mechanical methods for bulk removal
• Equipment can be costly and requires vacuum systems
• Not ideal for large-scale material removal

Ion beam milling operates by accelerating ions (usually argon) toward a sample surface in a vacuum. The kinetic energy of the ions physically removes atoms from the surface, allowing for controlled material removal. This process is highly directional and precise, making it ideal for microstructural analysis.