Microscope Calibration for Measurements: Why and How You Should Do It
Microscope calibration ensures accurate and consistent measurements for inspection, quality control (QC), failure analysis, and research and development (R&D). Calibration steps are described in this…
Automotive Part Verification and Development according to Specifications
Automotive part verification during the development and production of parts and components by suppliers or manufacturers is important for ensuring that specifications are met. Specifications are…
顕微鏡を知る：被写界深度
顕微鏡において被写界深度は、凹凸の変化が⼤きい構造を持つ試料をピントがあったシャープに観察・撮像するために重要なパラメータです。被写界深度は、開⼝数、解像度、倍率の相関関係によって決定され、解像度とパラメータは反⽐例の関係にあります。被写界深度と解像度のバランスが最適になるように調整することができる顕微鏡もあります。
Rapidly Visualizing Magnetic Domains in Steel with Kerr Microscopy
The rotation of polarized light after interaction with magnetic domains in a material, known as the Kerr effect, enables the investigation of magnetized samples with Kerr microscopy. It allows rapid…
6-Inch Wafer Inspection Microscope for Reliably Observing Small Height Differences
A 6-inch wafer inspection microscope with automated and reproducible DIC (differential interference contrast) imaging, no matter the skill level of users, is described in this article. Manufacturing…
Burr Detection During Battery Manufacturing
See how optical microscopy can be used for burr detection on battery electrodes and determination of damage potential to achieve rapid and reliable quality control during battery manufacturing.
Battery Particle Detection During the Production Process
How battery particle detection and analysis is enhanced with optical microscopy and laser spectroscopy for rapid, reliable, and cost-effective QC during battery production is explained in this…
Key Factors for Efficient Cleanliness Analysis
An overview of the key factors necessary for technical cleanliness and efficient cleanliness analysis concerning automotive and electronics manufacturing and production is provided in this article.
Cross-section Analysis for Electronics Manufacturing
This article describes cross-section analysis for electronics concerning quality control and failure analysis of printed circuit boards (PCBs) and assemblies (PCBAs), integrated circuits (ICs), etc.
