ライフサイエンス

ライフサイエンス

ライフサイエンス

様々な科学分野における顕微鏡の知識、研究技術、そして実用的な応用を深めるための場です。正確な観察、画像解析、そして研究の進歩を実現する方法を学びましょう。高度な顕微鏡技術、イメージング技術、サンプル前処理、画像解析に関する専門的な知見を提供します。最先端のアプリケーションやイノベーションを中心に、細胞生物学、神経科学、がん研究などの分野を幅広くカバーしています。

ゼブラフィッシュを用いた研究

スクリーニング、ソーティング、マニピュレーションおよびイメージングを通じて最良の結果を得るためには、細部や構造を観察して、研究の次の段階に向けて正しい判断を下す必要があります。 優れた光学系と高解像度で定評のあるライカの実体顕微鏡と透過照明スタンドは、世界中の研究者から支持されています。
Ivesta 3 with integrated monitor.

レーザーマイクロダイセクション

小動物などの解剖を行うとき、顕微鏡の接眼レンズを何時間ものぞくことがあります。 ライカ マイクロシステムズでは、さまざまな顕微鏡と幅広い解剖顕微鏡部品やアクセサリーから選ぶことができるため、ニーズに最適な顕微鏡ソリューションを見つけることができます。
Area of a printed circuit board (PCB) which was imaged with extended depth of field (EDOF) using digital microscopy.

顕微鏡を知る:被写界深度

顕微鏡において被写界深度は、凹凸の変化が⼤きい構造を持つ試料をピントがあったシャープに観察・撮像するために重要なパラメータです。被写界深度は、開⼝数、解像度、倍率の相関関係によって決定され、解像度とパラメータは反⽐例の関係にあります。被写界深度と解像度のバランスが最適になるように調整することができる顕微鏡もあります。
Image of magnetic steel taken with a 100x objective using Kerr microscopy. The magnetic domains in the grains appear in the image with lighter and darker patterns. A few domains are marked with red arrows. Courtesy of Florian Lang-Melzian, Robert Bosch GmbH, Germany.

Rapidly Visualizing Magnetic Domains in Steel with Kerr Microscopy

The rotation of polarized light after interaction with magnetic domains in a material, known as the Kerr effect, enables the investigation of magnetized samples with Kerr microscopy. It allows rapid…
Region of a patterned wafer inspected using optical microscopy and automated and reproducible DIC (differential interference contrast). With DIC users are able to visualize small height differences on the wafer surface more easily.

6-Inch Wafer Inspection Microscope for Reliably Observing Small Height Differences

A 6-inch wafer inspection microscope with automated and reproducible DIC (differential interference contrast) imaging, no matter the skill level of users, is described in this article. Manufacturing…
Optical microscope image, which is a composition of both brightfield and fluorescence illumination, showing organic contamination on a wafer surface. The inset images in the upper left corner show the brightfield image (above) and fluorescence image (below with dark background).

Visualizing Photoresist Residue and Organic Contamination on Wafers

As the scale of integrated circuits (ICs) on semiconductors passes below 10 nm, efficient detection of organic contamination, like photoresist residue, and defects during wafer inspection is becoming…
Image of burrs (red arrows) at the edge of a battery electrode acquired with a DVM6 digital microscope.

Burr Detection During Battery Manufacturing

See how optical microscopy can be used for burr detection on battery electrodes and determination of damage potential to achieve rapid and reliable quality control during battery manufacturing.
Particulate contamination in between moving metal plates.

Key Factors for Efficient Cleanliness Analysis

An overview of the key factors necessary for technical cleanliness and efficient cleanliness analysis concerning automotive and electronics manufacturing and production is provided in this article.
Images of the same area of a processed wafer taken with standard (left) and oblique (right) brightfield illumination using a Leica compound microscope. The defect on the wafer surface is clearly more visible with oblique illumination.

Rapid Semiconductor Inspection with Microscope Contrast Methods

Semiconductor inspection during the production of patterned wafers and ICs (integrated circuits) is important for identifying and minimizing defects. To increase the efficiency of quality control in…
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