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Cross Section Ion Beam Milling of Battery Components
Sample Preparation of Lithium battery systems requires high quality surface preparation to evaluate their internal structure and morphology. Due to…
Oct 13, 2021Workflow - Loading...
Introduction to Ion Beam Etching with the EM TIC 3X
In this article you can learn how to optimize the preparation quality of your samples by using the ion beam etching method with the EM TIC 3X ion beam…
May 11, 2020Tutorial - Loading...
Studying the Microstructure of Natural Polymers in Fine Detail
The potential of cryogenic broad ion beam milling used in combination with scanning electron microscopy (cryo-BIB-SEM) for imaging and analyzing the…
Oct 16, 2019Story - Loading...
Practical Applications of Broad Ion Beam Milling
Mechanical polishing can be time consuming and frustrating. It can also introduce unwanted artifacts when preparing cross-sectioned samples for…
Sep 14, 2017Webinar - Loading...
Cross Sectioning of Cadmiumsulphide (CdS) for Cathodoluminescence
Cathodoluminescence can be used to achieve spectra and high resolution images of impurity and structural defects in semicondoctors, minerals and…
Jan 24, 2017Story - Loading...
Cross Sectioning of Copper for Electron Backscattered Diffraction (EBSD)
Application Note for Leica EM TIC 3X - Electron Backscattered Diffraction (EBSD) is a surface technique creating diffraction patterns (Kikuchi-bands).…
Jan 19, 2017Story - Loading...
Porous Ceramics - Sample Preparation for SEM
Application Note for Leica EM RES102 - Ceramic membrane filters with pore sizes down to a few nanometres must be investigated in cross-section with…
Jan 17, 2017Story - Loading...
Removal of Surface Layers - Sample Preparation for SEM and TEM
Application Note for Leica EM RES102 - Sometimes it is necessary to remove surface layers to gain access to the real surface structure. That can be a…
Jan 11, 2017Story - Loading...
Multilayer Systems with Widely Different Sputter Rates - Sample Preparation for TEM
Application Note for Leica EM RES102 - The multi-layer system to be prepared in cross-section consists of a Si substrate, a TiN layer with a thickness…
Dec 16, 2016Story - Loading...
![High resolution XTEM lattice [110] image of conventional prepared InP](/fileadmin/_processed_/b/b/csm_Compound_3_f7523e2740.jpg "In-Containing Compound Semiconductors - Sample Preparation for TEM")
In-Containing Compound Semiconductors - Sample Preparation for TEM
Application Note for Leica EM RES102 - Previous studies showed that surface accumulation of In occurs when InP was milled in a conventional way with…
Dec 12, 2016Story - Loading...
Each Atom Counts: Protect Your Samples Prior to FIB Processing
Application Note for Leica EM ACE600 - Focused ion beam (FIB) technology has become an indispensable tool for site-specific TEM sample preparation. It…
Nov 23, 2016Story - Loading...
"Shallow Trench Isolation" Structures - Sample Preparation for TEM
Application Note for Leica EM RES102 - The cross-sectional preparation of structured semiconductor materials requires a very thorough mechanical…
Nov 18, 2016Story - Loading...
Paper Samples - Sample Preparation for SEM
Application Note for Leica EM RES102 - A coated paper sample has been prepared with ion beam slope cutting in order to test the procedure with regard…
Nov 16, 2016Story - Loading...
Contrast Enhancement of Polished Cross Sections of Semiconductor Structures - Sample Preparation for SEM
Application Note for Leica EM RES102 - The surfaces of polished cross sections often show fine scratches and residues of the removed material or of…
Oct 28, 2016Story - Loading...
Cross Sectioning of Painted Concrete
Application Note for Leica EM TIC 3X - Ion beam slope cutting is a method that can achieve flat cuts of material combinations consisting of hard and…
Oct 10, 2016Story - Loading...
Thin Metal Foils with Coatings - Sample Preparation for SEM
Application Note for Leica EM RES102 - Thin foils are mostly unstable because of their thickness of a few microns. This makes it difficult to do slope…
Oct 05, 2016Story - Loading...
Cross Sectioning of a Superconductive Wire
Application Note for Leica EM TIC 3X - Purpose: The shape of the wire is difficult for ion beam slope cutting. Goal: Cross sectional preparation to…
Sep 20, 2016Story - Loading...
Ion Beam Polishing of Sample Surfaces - Sample Preparation for SEM
Application Note for Leica EM RES102 - Ion milling can be used to reduce the roughness of sample surfaces. Small angles less than 6° with respect to…
Sep 06, 2016Story